Tailored for ultra-restricted building shafts and ceiling voids, this configuration eliminates air gaps to deliver maximum power density with minimal physical footprint.

   With space tightly constrained in modern electrical rooms, the physical footprint of your infrastructure is more critical than ever. This sandwich-type configuration is specifically engineered for high-density power transmission—handling incoming lines (incomers), bus ties, and outgoing circuits within an ultra-compact profile that easily navigates the tightest layouts.