Proprietary dual-surface joint technology that minimizes thermal resistance to micro-ohm levels, directly reducing cooling overheads and optimizing site PUE.

 Micro-Ohm Contact Resistance: Doubles the contact area compared to traditional single-sided connections, slashing contact resistance to the micro-ohm (μΩ) level and reducing joint heat generation by up to 40%.

 Enhanced Current-Carrying Capacity: Increases the conductor cross-sectional area at the joint by over 30% (up to 1.2x), completely eradicating transmission bottlenecks to ensure ultra-stable power supply under extreme loads.

 Optimizing Facility PUE: Significantly lowers line power losses (<span class="math">I²R</span> losses), directly mitigating the data center's cooling requirements and effectively optimizing overall PUE metrics.

 Sustained Pressure System: Engineered with high-performance Belleville washers to guarantee uniform, long-lasting pressure across the double-sided joint, achieving true long-term maintenance-free operation.